Smart Card Manufacturing
Description
* Details the structure and manufacturing processes of smart cards, an area largely omitted from other recent publications.
* Coverage of the full range of techniques applied to the development and production of smart cards.
* Presents an overview of the development of smartcards and the range of their evolving applications. Preface.
Function and Structure of a Smart Card.
Card Body for Smart Cards.
Manufacturing Processes for Card Bodies.
Embedding of Chip Modules into Smart Cards.
Chips.
Chip Modules.
Production Processes for Smart Cards.
Smart Cards without Chip Modules.
Reliability Tests for Chip Modules and Smart Cards.
Personalization and Mailing of Smart Cards.
New Applications for Smart Cards.
Short Cuts.
Bibliography.
Appendix.
Index
Yahya Haghiri is the author of Smart Card Manufacturing: A Practical Guide, published by Wiley.
Thomas Tarantino is the author of Smart Card Manufacturing: A Practical Guide, published by Wiley. The smart card industry is booming as demand for data protection increases. From secure e-commerce and mobile communications to electronic tracking and ticketing systems, smart card technology facilitates a broad array of applications. This practical guide bridges the gap between smart card applications and software, providing an accessible introduction to a versatile technology.
Featuring:
- Step-by-step descriptions of the production processes for chip modules, traditional, contactless and dual-interface smart cards.
- Guidance on the choice of materials for use in each smart card component.
- Coverage of all the major reliability testing methods and test criteria for chip modules and smart cards.
- The architecture and functionality of the full range of available smart cards along with outlines of the related standards.
- An examination of future smart card applications and an overview of chips currently on the market.
- Contact details and relevant web sites for all the major smart card manufacturers and materials suppliers.
PUBLISHER:
Wiley
ISBN-13:
9780471497677
BINDING:
Hardback
BISAC:
Technology & Engineering
BOOK DIMENSIONS:
Dimensions: 174.00(W) x Dimensions: 251.00(H) x Dimensions: 18.90(D)
AUDIENCE TYPE:
General/Adult
LANGUAGE:
English