{"product_id":"semiconductor-microchips-and-fabrication-isbn-9781119867784","title":"Semiconductor Microchips and Fabrication","description":"\u003cb\u003eSemiconductor Microchips and Fabrication\u003c\/b\u003e \u003cp\u003e\u003cb\u003eAdvanced and highly illustrated guide to semiconductor manufacturing from an experienced industry insider\u003c\/b\u003e \u003c\/p\u003e\u003cp\u003e\u003ci\u003eSemiconductor Microchips and Fabrication\u003c\/i\u003e is a practical yet advanced book on the theory, design, and manufacturing of semiconductor microchips that describes the process using the principles of physics and chemistry, fills in the knowledge gaps for professionals and students who need to know how manufacturing equipment works, and provides valuable suggestions and solutions to many problems that students or engineers often encounter in semiconductor processing, including useful experiment results to help in process work. \u003c\/p\u003e\u003cp\u003eThe explanation of the semiconductor manufacturing process, and the equipment needed, is carried out based on the machines that are used in clean rooms over the world so readers understand how they can use the equipment to achieve their design and manufacturing ambitions. Combining theory with practice, all descriptions are carried out around the actual equipment and processes by way of a highly visual text, with illustrations including equipment pictures, manufacturing process schematics, and structures of semiconductor microchips. \u003c\/p\u003e\u003cp\u003eSample topics covered in \u003ci\u003eSemiconductor Microchips and Fabrication\u003c\/i\u003e include:  \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eAn introduction to basic concepts, such as impedance mismatch from plasma machines and theories, such as energy bands and Clausius-Clapeyron equation\u003c\/li\u003e \u003cli\u003eBasic knowledge used in semiconductor devices and manufacturing machines, including DC and AC circuits, electric fields, magnetic fields, resonant cavity, and the components used in the devices and machines\u003c\/li\u003e \u003cli\u003eTransistor and integrated circuits, including bipolar transistors, junction field effect transistors, and metal-semiconductor field effect transistors\u003c\/li\u003e \u003cli\u003eThe main processes used in the manufacturing of microchips, including lithography, metallization, reactive-ion etching (RIE), plasma-enhanced chemical vapor deposition (PECVD), thermal oxidation and implantation, and more\u003c\/li\u003e \u003cli\u003eThe skills in the design and problem solving of processes, such as how to design a dry etching recipe, and how to solve the micro-grass problems in Bosch process\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003eThrough \u003ci\u003eSemiconductor Microchips and Fabrication,\u003c\/i\u003e readers can obtain the fundamental knowledge and skills of semiconductor manufacturing, which will help them better understand and use semiconductor technology to improve their product quality or project research. Before approaching this text, readers should have basic knowledge of physics, chemistry, and circuitry. \u003c\/p\u003e\u003cp\u003eAuthor Biography xi\u003c\/p\u003e \u003cp\u003ePreface xiii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction to the Basic Concepts 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 What Is a Microchip? 1\u003c\/p\u003e \u003cp\u003e1.2 Ohm’s Law and Resistivity 1\u003c\/p\u003e \u003cp\u003e1.3 Conductor, Insulator, and Semiconductor 5\u003c\/p\u003e \u003cp\u003eReferences 5\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Brief Introduction of Theories 7\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 The Birth of Quantum Mechanics 7\u003c\/p\u003e \u003cp\u003e2.2 Energy Band (Band) 11\u003c\/p\u003e \u003cp\u003eReferences 15\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Early Radio Communication 17\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Telegraph Technology 17\u003c\/p\u003e \u003cp\u003e3.2 Electron Tube 19\u003c\/p\u003e \u003cp\u003eReferences 22\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Basic Knowledge of Electric Circuits (Circuits) 23\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Electric Circuits and the Components 23\u003c\/p\u003e \u003cp\u003e4.2 Electric Field 26\u003c\/p\u003e \u003cp\u003e4.3 Magnetic Field 28\u003c\/p\u003e \u003cp\u003e4.4 Alternating Current 30\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Further Discussion of Semiconductors and Diodes 33\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Semiconductor Energy Band 33\u003c\/p\u003e \u003cp\u003e5.2 Semiconductor Doping 36\u003c\/p\u003e \u003cp\u003e5.3 Semiconductor Diode 42\u003c\/p\u003e \u003cp\u003eReferences 46\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Transistor and Integrated Circuit 47\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Bipolar Transistor 47\u003c\/p\u003e \u003cp\u003e6.2 Junction Field Effect Transistor 49\u003c\/p\u003e \u003cp\u003e6.3 Metal–Semiconductor Field Effect Transistor 52\u003c\/p\u003e \u003cp\u003e6.4 Metal–Insulator–Semiconductor Field Effect Transistor 55\u003c\/p\u003e \u003cp\u003eReferences 60\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 The Development History of Semiconductor Industry 61\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 The Instruction of Semiconductor Products and Structures 61\u003c\/p\u003e \u003cp\u003e7.2 A Brief History of the Semiconductor Industry 63\u003c\/p\u003e \u003cp\u003e7.3 Changes in the Size of Transistors and SiliconWafers 65\u003c\/p\u003e \u003cp\u003e7.4 Clean Room 67\u003c\/p\u003e \u003cp\u003e7.5 Planar Process 71\u003c\/p\u003e \u003cp\u003eReferences 75\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Semiconductor Photonic Devices 77\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Light-Emitting Devices and Light-Emitting Principles 77\u003c\/p\u003e \u003cp\u003e8.2 Light-Emitting Diode (LED) 82\u003c\/p\u003e \u003cp\u003e8.3 Semiconductor Diode Laser 88\u003c\/p\u003e \u003cp\u003e8.3.1 Resonant Cavity 89\u003c\/p\u003e \u003cp\u003e8.3.2 Reflection and Refraction of Light 91\u003c\/p\u003e \u003cp\u003e8.3.3 Heterojunction Materials 93\u003c\/p\u003e \u003cp\u003e8.3.4 Population Inversion and Threshold Current Density 94\u003c\/p\u003e \u003cp\u003eReferences 96\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Semiconductor Light Detection and Photocell 97\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Digital Camera and CCD 97\u003c\/p\u003e \u003cp\u003e9.2 Photoconductor 100\u003c\/p\u003e \u003cp\u003e9.3 Transistor Laser 101\u003c\/p\u003e \u003cp\u003e9.4 Solar Cell 105\u003c\/p\u003e \u003cp\u003eReferences 106\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Manufacture of Silicon Wafer 109\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 From Quartzite Ore to Polysilicon 110\u003c\/p\u003e \u003cp\u003e10.2 Chemical Reaction 113\u003c\/p\u003e \u003cp\u003e10.3 Pull Single Crystal 115\u003c\/p\u003e \u003cp\u003e10.4 Polishing and Slicing 116\u003c\/p\u003e \u003cp\u003eReferences 123\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Basic Knowledges of Process 125\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 The Structure of Integrated Circuit (IC) 125\u003c\/p\u003e \u003cp\u003e11.2 Resolution of Optical System 128\u003c\/p\u003e \u003cp\u003e11.3 Why Plasma Used in the Process 131\u003c\/p\u003e \u003cp\u003eReferences 133\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Photolithography (Lithography) 135\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 The Steps of Lithography Process 135\u003c\/p\u003e \u003cp\u003e12.1.1 Cleaning 135\u003c\/p\u003e \u003cp\u003e12.1.2 Dehydration Bake 136\u003c\/p\u003e \u003cp\u003e12.1.3 Photoresist Coating 138\u003c\/p\u003e \u003cp\u003e12.1.4 Soft Bake 141\u003c\/p\u003e \u003cp\u003e12.1.5 Alignment and Exposure 141\u003c\/p\u003e \u003cp\u003e12.1.6 Developing 145\u003c\/p\u003e \u003cp\u003e12.1.7 Inspection 146\u003c\/p\u003e \u003cp\u003e12.1.8 Hard Bake 147\u003c\/p\u003e \u003cp\u003e12.1.9 Descum 148\u003c\/p\u003e \u003cp\u003e12.2 Alignment Mark (Mark) Design on the Photomask 152\u003c\/p\u003e \u003cp\u003e12.3 Contemporary Photolithography Equipment Technologies 156\u003c\/p\u003e \u003cp\u003eReferences 159\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Dielectric Films Growth 161\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 The Growth of Silicon Dioxide Film 162\u003c\/p\u003e \u003cp\u003e13.1.1 Thermal Oxidation Process of SiO2 162\u003c\/p\u003e \u003cp\u003e13.1.2 LTO Process 164\u003c\/p\u003e \u003cp\u003e13.1.3 PECVD Process of Silicon Dioxide 166\u003c\/p\u003e \u003cp\u003e13.1.4 TEOS + O3 Deposition Using APCVD System 167\u003c\/p\u003e \u003cp\u003e13.2 The Growth of Silicon Nitride Film 168\u003c\/p\u003e \u003cp\u003e13.2.1 LPCVD 168\u003c\/p\u003e \u003cp\u003e13.2.2 PECVD Process of Silicon Nitride 171\u003c\/p\u003e \u003cp\u003e13.3 Atomic Layer Deposition Technique 174\u003c\/p\u003e \u003cp\u003eReferences 177\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 Introduction of Etching and RIE System 179\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e14.1 Wet Etching 179\u003c\/p\u003e \u003cp\u003e14.2 RIE System for Dry Etching 182\u003c\/p\u003e \u003cp\u003e14.2.1 RIE Process Flow and Equipment Structure 182\u003c\/p\u003e \u003cp\u003e14.2.2 Process Chamber 184\u003c\/p\u003e \u003cp\u003e14.2.3 Vacuum Pumps 186\u003c\/p\u003e \u003cp\u003e14.2.4 RF Power Supply (Source) and Matching Network (Matchwork) 187\u003c\/p\u003e \u003cp\u003e14.2.5 Gas Cylinder and Mass Flow Controller (MFC) 189\u003c\/p\u003e \u003cp\u003e14.2.6 Heater and Coolant 194\u003c\/p\u003e \u003cp\u003eReferences 196\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 Dry Etching 197\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e15.1 The Etch Profile of RIE 197\u003c\/p\u003e \u003cp\u003e15.1.1 Case 1 198\u003c\/p\u003e \u003cp\u003e15.1.2 Case 2 201\u003c\/p\u003e \u003cp\u003e15.2 Etching Rate of RIE 203\u003c\/p\u003e \u003cp\u003e15.3 Dry Etching of III–V Semiconductors and Metals 206\u003c\/p\u003e \u003cp\u003e15.4 Etch Profile Control 207\u003c\/p\u003e \u003cp\u003e15.4.1 Influence of the PR Opening Shape on the Etch Profile 208\u003c\/p\u003e \u003cp\u003e15.4.2 The Effect of Carbon on Etching Rate and Profile 209\u003c\/p\u003e \u003cp\u003e15.5 Other Issues 211\u003c\/p\u003e \u003cp\u003e15.5.1 The Differences Between RIE and PECVD 211\u003c\/p\u003e \u003cp\u003e15.5.2 The Difference Between Si and SiO2 Dry Etching 214\u003c\/p\u003e \u003cp\u003e15.6 Inductively Coupled Plasma (ICP) Technique and Bosch Process 215\u003c\/p\u003e \u003cp\u003e15.6.1 Inductively Coupled Plasma Technique 216\u003c\/p\u003e \u003cp\u003e15.6.2 Bosch Process 219\u003c\/p\u003e \u003cp\u003eReferences 223\u003c\/p\u003e \u003cp\u003e\u003cb\u003e16 Metal Processes 225\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e16.1 Thermal Evaporation Technique 225\u003c\/p\u003e \u003cp\u003e16.2 Electron Beam Evaporation Technique 227\u003c\/p\u003e \u003cp\u003e16.3 Magnetron Sputtering Deposition Technique 231\u003c\/p\u003e \u003cp\u003e16.4 The Main Differences Between Electron Beam (Thermal) Evaporation and Sputtering Deposition 234\u003c\/p\u003e \u003cp\u003e16.5 Metal Lift-off Process 235\u003c\/p\u003e \u003cp\u003e16.6 Metal Selection and Annealing Technology 241\u003c\/p\u003e \u003cp\u003e16.6.1 The Selection of Metals 241\u003c\/p\u003e \u003cp\u003e16.6.2 Metal Annealing 242\u003c\/p\u003e \u003cp\u003eReferences 243\u003c\/p\u003e \u003cp\u003e\u003cb\u003e17 Doping Processes 245\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e17.1 Basic Introduction of Doping 245\u003c\/p\u003e \u003cp\u003e17.2 Basic Principles of Diffusion 246\u003c\/p\u003e \u003cp\u003e17.3 Thermal Diffusion 247\u003c\/p\u003e \u003cp\u003e17.4 Diffusion and Redistribution of Impurities in SiO2 248\u003c\/p\u003e \u003cp\u003e17.5 Minimum Thickness of SiO2 Masking Film 250\u003c\/p\u003e \u003cp\u003e17.6 The Distribution of Impurities Under the SiO2 Masking Film 251\u003c\/p\u003e \u003cp\u003e17.7 Diffusion Impurity Sources 252\u003c\/p\u003e \u003cp\u003e17.8 Parameters of the Diffusion Layer 255\u003c\/p\u003e \u003cp\u003e17.9 Four-Point Probe Sheet Resistance Measurement 256\u003c\/p\u003e \u003cp\u003e17.10 Ion Implantation Process 257\u003c\/p\u003e \u003cp\u003e17.11 Theoretical Analysis of Ion Implantation 259\u003c\/p\u003e \u003cp\u003e17.12 Impurity Distribution after Implantation 260\u003c\/p\u003e \u003cp\u003e17.13 Type and Dose of Implanted Impurities 262\u003c\/p\u003e \u003cp\u003e17.14 The Minimum Thickness of Masking Film 263\u003c\/p\u003e \u003cp\u003e17.15 Annealing Process 264\u003c\/p\u003e \u003cp\u003e17.16 Buried Implantation 266\u003c\/p\u003e \u003cp\u003e17.16.1 Implantation through Masking Film 266\u003c\/p\u003e \u003cp\u003e17.16.2 SOI Manufacture 267\u003c\/p\u003e \u003cp\u003eReferences 270\u003c\/p\u003e \u003cp\u003e\u003cb\u003e18 Process Control Monitor, Packaging, and the Others 271\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e18.1 Dielectric Film Quality Inspection 271\u003c\/p\u003e \u003cp\u003e18.2 Ohmic Contact Test 273\u003c\/p\u003e \u003cp\u003e18.3 Metal-to-Metal Contact 274\u003c\/p\u003e \u003cp\u003e18.4 Conductive Channel Control 277\u003c\/p\u003e \u003cp\u003e18.5 Chip Testing 278\u003c\/p\u003e \u003cp\u003e18.6 Dicing 279\u003c\/p\u003e \u003cp\u003e18.7 Packaging 280\u003c\/p\u003e \u003cp\u003e18.8 Equipment Operation Range 281\u003c\/p\u003e \u003cp\u003e18.9 Low-\u003ci\u003ek \u003c\/i\u003eand High-\u003ci\u003ek \u003c\/i\u003eDielectrics 282\u003c\/p\u003e \u003cp\u003e18.9.1 Copper Interconnection and Low-\u003ci\u003ek \u003c\/i\u003eDielectrics 283\u003c\/p\u003e \u003cp\u003e18.9.2 Quantum Tunneling Effect and High-\u003ci\u003ek \u003c\/i\u003eDielectrics 286\u003c\/p\u003e \u003cp\u003e18.10 End 291\u003c\/p\u003e \u003cp\u003eReferences 293\u003c\/p\u003e \u003cp\u003eIndex 295\u003c\/p\u003e  \u003cp\u003e\u003cb\u003eMr. Yaguang Lian\u003c\/b\u003e is a Research Engineer at Holonyak Micro \u0026amp; Nanotechnology Lab, the University of Illinois, USA. In his twenty years of working, he has trained thousands of students in using the manufacturing machines. Before Mr. Lian came to the USA, he worked at the Hebei Semiconductor Research Institute (HSRI), China, for over 13 years. At HSRI, he oversaw the entire manufacturing process line, from implantation to packaging, in addition to IC design work. Working in the field of semiconductors for over 30 years, Mr. Lian deeply understands the key points of the manufacturing process and has a profound knowledge on both theory and equipment.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003eAdvanced and highly illustrated guide to semiconductor manufacturing from an experienced industry insider\u003c\/b\u003e \u003c\/p\u003e\u003cp\u003e\u003ci\u003eSemiconductor Microchips and Fabrication\u003c\/i\u003e is a practical yet advanced book on the theory, design, and manufacturing of semiconductor microchips that describes the process using the principles of physics and chemistry, fills in the knowledge gaps for professionals and students who need to know how manufacturing equipment works, and provides valuable suggestions and solutions to many problems that students or engineers often encounter in semiconductor processing, including useful experiment results to help in process work. \u003c\/p\u003e\u003cp\u003eThe explanation of the semiconductor manufacturing process, and the equipment needed, is carried out based on the machines that are used in clean rooms over the world so readers understand how they can use the equipment to achieve their design and manufacturing ambitions. Combining theory with practice, all descriptions are carried out around the actual equipment and processes by way of a highly visual text, with illustrations including equipment pictures, manufacturing process schematics, and structures of semiconductor microchips. \u003c\/p\u003e\u003cp\u003eSample topics covered in \u003ci\u003eSemiconductor Microchips and Fabrication\u003c\/i\u003e include:  \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eAn introduction to basic concepts, such as impedance mismatch from plasma machines and theories, such as energy bands and Clausius-Clapeyron equation\u003c\/li\u003e \u003cli\u003eBasic knowledge used in semiconductor devices and manufacturing machines, including DC and AC circuits, electric fields, magnetic fields, resonant cavity, and the components used in the devices and machines\u003c\/li\u003e \u003cli\u003eTransistor and integrated circuits, including bipolar transistors, junction field effect transistors, and metal-semiconductor field effect transistors\u003c\/li\u003e \u003cli\u003eThe main processes used in the manufacturing of microchips, including lithography, metallization, reactive-ion etching (RIE), plasma-enhanced chemical vapor deposition (PECVD), thermal oxidation and implantation, and more\u003c\/li\u003e \u003cli\u003eThe skills in the design and problem solving of processes, such as how to design a dry etching recipe, and how to solve the micro-grass problems in Bosch process\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003eThrough \u003ci\u003eSemiconductor Microchips and Fabrication,\u003c\/i\u003e readers can obtain the fundamental knowledge and skills of semiconductor manufacturing, which will help them better understand and use semiconductor technology to improve their product quality or project research. Before approaching this text, readers should have basic knowledge of physics, chemistry, and circuitry.\u003c\/p\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Default Title","offer_id":47990006350053,"sku":"NP9781119867784","price":130.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9781119867784.jpg?v=1761786192","url":"https:\/\/k12savings.com\/products\/semiconductor-microchips-and-fabrication-isbn-9781119867784","provider":"K12savings","version":"1.0","type":"link"}