{"product_id":"joining-processes-isbn-9780471964889","title":"Joining Processes","description":"\u003cp\u003eThis is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.\u003c\/p\u003e PRINCIPLES OF JOINING.\u003cbr\u003e \u003cbr\u003e Surface Science.\u003cbr\u003e \u003cbr\u003e The Mechanics of Joining.\u003cbr\u003e \u003cbr\u003e JOINING METHODS.\u003cbr\u003e \u003cbr\u003e Mechanical Bonding.\u003cbr\u003e \u003cbr\u003e Welding.\u003cbr\u003e \u003cbr\u003e Weld Metallurgy.\u003cbr\u003e \u003cbr\u003e Soldering and Brazing.\u003cbr\u003e \u003cbr\u003e Metal-Ceramic Joints and Diffusion Bonding.\u003cbr\u003e \u003cbr\u003e Adhesives.\u003cbr\u003e \u003cbr\u003e APPLICATIONS OF JOINING.\u003cbr\u003e \u003cbr\u003e Vacuum Seals.\u003cbr\u003e \u003cbr\u003e Microelectronic Packaging.\u003cbr\u003e \u003cbr\u003e Index. \u003cp\u003e\"This is a very informative book which groups together a number of varied topics.\"\u003cbr\u003e—\u003cb\u003e\u003ci\u003eAssembly Automation,\u003c\/i\u003e Vol 20\/2, 2000\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eDavid Brandon\u003c\/b\u003e,Technion, Israel Institute of Technology, Israel, is the author of \u003ci\u003eJoining Processes: An Introduction\u003c\/i\u003e, published by Wiley.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eWayne D. Kaplan\u003c\/b\u003e, Technion, Israel Institute of Technology, Israel, is the author of \u003ci\u003eJoining Processes: An\u003c\/i\u003e Introduction, published by Wiley.\u003c\/p\u003e This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47989491564773,"sku":"NP9780471964889","price":129.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9780471964889.jpg?v=1761784320","url":"https:\/\/k12savings.com\/products\/joining-processes-isbn-9780471964889","provider":"K12savings","version":"1.0","type":"link"}