{"product_id":"integrated-passive-component-technology-isbn-9780471244318","title":"Integrated Passive Component Technology","description":"\u003cul\u003e \u003cli\u003eThis is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.\u003c\/li\u003e \u003cli\u003eDescribes the processes available for creating integrated passives, measuring their properties, and applying them.\u003c\/li\u003e \u003cli\u003eBrings reader up to date in a fast-moving technology.\u003c\/li\u003e \u003cli\u003eEnables reader to implement the technology into a manufacturing environment.\u003c\/li\u003e \u003cli\u003eCovers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.\u003c\/li\u003e \u003cli\u003eDescribes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.\u003c\/li\u003e \u003c\/ul\u003e  Contributors.  \u003cp\u003ePreface.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e1.1 Status and Trends in Discrete Passive Components.\u003c\/p\u003e \u003cp\u003e1.2 Definitions and Configurations of Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.3 Comparison to Integrated Active Devices.\u003c\/p\u003e \u003cp\u003e1.4 Substrates and Interconnect Systems for Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.5 Fabrication of Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.6 Reasons for Integrating Passive Devices.\u003c\/p\u003e \u003cp\u003e1.7 Problems with Integrating Passive Devices.\u003c\/p\u003e \u003cp\u003e1.8 Applications for Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.9 The Past and Future of Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.10 Organization of this Book.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Characteristics and Performance of Planar Resistors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e2.1 Performance Parameters.\u003c\/p\u003e \u003cp\u003e2.2 Resistance in Electronic Materials.\u003c\/p\u003e \u003cp\u003e2.3 Sizing Integrated Resistors.\u003c\/p\u003e \u003cp\u003e2.4 Trimming.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Integrated Resistor Materials and Processes\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e3.1 Single-Component Metals.\u003c\/p\u003e \u003cp\u003e3.2 Metal Alloys and Metal–Nonmetal Compounds.\u003c\/p\u003e \u003cp\u003e3.3 Semiconductors.\u003c\/p\u003e \u003cp\u003e3.4 Cermets.\u003c\/p\u003e \u003cp\u003e3.5 Polymer Thick Film.\u003c\/p\u003e \u003cp\u003e3.6 Ink Jet Deposition.\u003c\/p\u003e \u003cp\u003e3.7 Commercialized Processes.\u003c\/p\u003e \u003cp\u003e3.8 Summary.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Dielectric Materials for Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e4.1 Polarizability and Capacitance.\u003c\/p\u003e \u003cp\u003e4.2 Capacitance Density.\u003c\/p\u003e \u003cp\u003e4.3 Temperature Effects.\u003c\/p\u003e \u003cp\u003e4.4 Frequency and Voltage Effects.\u003c\/p\u003e \u003cp\u003e4.5 Aging Effects.\u003c\/p\u003e \u003cp\u003e4.6 Composition and Morphology Effects.\u003c\/p\u003e \u003cp\u003e4.7 Leakage and Breakdown.\u003c\/p\u003e \u003cp\u003e4.8 Dissipation Factor.\u003c\/p\u003e \u003cp\u003e4.9 Comparison to EIA Dielectric Classifications.\u003c\/p\u003e \u003cp\u003e4.10 Matching Dielectric Materials to Applications.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Size and Configuration of Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e5.1 Comparison of Integrated and Discrete Areas.\u003c\/p\u003e \u003cp\u003e5.2 Layout Options.\u003c\/p\u003e \u003cp\u003e5.3 Tolerance.\u003c\/p\u003e \u003cp\u003e5.4 Mixed Dielectric Strategies.\u003c\/p\u003e \u003cp\u003e5.5 CV Product.\u003c\/p\u003e \u003cp\u003e5.6 Maximum Capacitance Density and Breakdown Voltage.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Processing Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e6.1 Sputtering.\u003c\/p\u003e \u003cp\u003e6.2 CVD, PECVD and MOCVD.\u003c\/p\u003e \u003cp\u003e6.3 Anodization.\u003c\/p\u003e \u003cp\u003e6.4 Sol-Gel and Hydrothermal Ferroelectrics.\u003c\/p\u003e \u003cp\u003e6.5 Thin- and Thick-Film Polymers.\u003c\/p\u003e \u003cp\u003e6.6 Thick-Film Dielectrics.\u003c\/p\u003e \u003cp\u003e6.7 Interlayer Insulation.\u003c\/p\u003e \u003cp\u003e6.8 Interdigitated Capacitors.\u003c\/p\u003e \u003cp\u003e6.9 Capacitor Plate Materials.\u003c\/p\u003e \u003cp\u003e6.10 Trimming Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e6.11 Commercialized Integrated Capacitor Technologies.\u003c\/p\u003e \u003cp\u003e6.12 Summary.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Defects and Yield Issues\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e7.1 Causes of Fatal Defects in Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e7.2 Measurement of Defect Density.\u003c\/p\u003e \u003cp\u003e7.3 Defect Density and System Yield.\u003c\/p\u003e \u003cp\u003e7.3.1 Predicting Yield from Defect Density.\u003c\/p\u003e \u003cp\u003e7.4 Yield Enhancement Techniques for Capacitors.\u003c\/p\u003e \u003cp\u003e7.5 Conclusions.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Electrical Performance of Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich and Leonard W. Schaper\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e8.1 Modeling Ideal Passives.\u003c\/p\u003e \u003cp\u003e8.2 Modeling Real Capacitors.\u003c\/p\u003e \u003cp\u003e8.3 Electrical Performance of Discrete and Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e8.4 Dissipation Factor of Real Capacitors.\u003c\/p\u003e \u003cp\u003e8.5 Measurement of Capacitor Properties.\u003c\/p\u003e \u003cp\u003e8.6 Summary.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Decoupling\u003c\/b\u003e (\u003ci\u003eLeonard W. Schaper\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e9.1 Power Distribution.\u003c\/p\u003e \u003cp\u003e9.2 Decoupling with Discrete Capacitors.\u003c\/p\u003e \u003cp\u003e9.3 Decoupling with Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e9.4 Dielectrics and Configurations for Integrated Decoupling.\u003c\/p\u003e \u003cp\u003e9.5 Integrated Decoupling as an Entry Application.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Integrated Inductors\u003c\/b\u003e (\u003ci\u003eGeert J. Carchon and Walter De Raedt\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e10.1 Introduction.\u003c\/p\u003e \u003cp\u003e10.2 Inductor Behavior and Performance Parameters.\u003c\/p\u003e \u003cp\u003e10.3 Inductor Performance Prediction.\u003c\/p\u003e \u003cp\u003e10.4 Integrated Inductor Examples.\u003c\/p\u003e \u003cp\u003e10.5 Use of Inductors in Circuits: Examples.\u003c\/p\u003e \u003cp\u003e10.6 Conclusions.\u003c\/p\u003e \u003cp\u003eAcknowledgments.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Modeling of Integrated Inductors and Resistors for Microwave Applications\u003c\/b\u003e (\u003ci\u003eZhenwen Wang, M. Jamal Deen, and A. H. Rahal\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e11.1 Introduction.\u003c\/p\u003e \u003cp\u003e11.2 Modeling of Spiral Inductors.\u003c\/p\u003e \u003cp\u003e11.3 Modeling of Thin-Film Resistors.\u003c\/p\u003e \u003cp\u003e11.4 Conclusions.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003eAppendix: Characteristics of Microscript Lines.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Other Applications and Integration Technologies\u003c\/b\u003e (\u003ci\u003eElizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e12.1 Demonstration Devices Fabricated with Integrated Passives.\u003c\/p\u003e \u003cp\u003e12.2 Commercialized Thin-Film Build-Up Integrated Passives.\u003c\/p\u003e \u003cp\u003e12.3 Other Integrated Passive Technologies.\u003c\/p\u003e \u003cp\u003e12.4 Summary.\u003c\/p\u003e \u003cp\u003eAcknowledgments.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 The Economics of Embedded Passives\u003c\/b\u003e (\u003ci\u003ePeter A. Sandborn\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e13.1 Introduction.\u003c\/p\u003e \u003cp\u003e13.2 Modeling Embedded Passive Economics.\u003c\/p\u003e \u003cp\u003e13.3 Key Aspects of Modeling Embedded Passive Costs.\u003c\/p\u003e \u003cp\u003e13.4 Example Case Studies.\u003c\/p\u003e \u003cp\u003e13.5 Summary.\u003c\/p\u003e \u003cp\u003eAcknowledgments.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 The Future of Integrated Passives\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e14.1 Status of Passive Integration.\u003c\/p\u003e \u003cp\u003e14.2 Issues for Implementation on Organic Substrates.\u003c\/p\u003e \u003cp\u003e14.3 Progress on Board-Level Implementation.\u003c\/p\u003e \u003cp\u003e14.4 Three Ways In for Organic Boards.\u003c\/p\u003e \u003cp\u003e14.5 Conclusion.\u003c\/p\u003e \u003cp\u003eIndex.\u003c\/p\u003e \u003cp\u003eAbout the Editors.\u003c\/p\u003e  \"…a comprehensive look at the reasons and current challenges…[of integrating] passive devices into board or IC…just the right dose of the math to explain the physics and theory behind the technology.\" (\u003ci\u003eIEEE Circuits \u0026amp; Devices Magazine\u003c\/i\u003e, Jan\/Feb 2005)  \u003cp\u003e\"...an interesting and useful book; I wholeheartedly recommend it.\"(Circuit World, Vol.30, No. 2003)\u003c\/p\u003e  RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division.  \u003cp\u003eLEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.\u003c\/p\u003e  An important real-world look at the status and future of integrated passives  \u003cp\u003eThis book provides an overview of the technology, potential applications, motivations, and problems associated with integrating resistors, capacitors, and inductors into circuit boards instead of mounting them as discrete components on the surface. Written primarily for engineers and scientists in industry who want to determine if passive integration is a viable option for a particular product, the text describes the processes available for designing and fabricating integrated passives, measuring their properties, and applying them to microelectronic systems.\u003c\/p\u003e \u003cp\u003eIn order to bring professionals up to date in this fast-moving technology and enable them to implement it into their own manufacturing environments, the editors address some basic questions concerning the tradeoffs between discrete and integrated approaches, including:\u003c\/p\u003e \u003cul\u003e \u003cli\u003eWhat are the advantages and disadvantages of integrated passives?\u003c\/li\u003e \u003cli\u003eIs this processing compatible with existing substrates?\u003c\/li\u003e \u003cli\u003eCan integrated passives be made with conventional PWB fabrication equipment?\u003c\/li\u003e \u003cli\u003eHow do the electrical characteristics of integrated passives differ from discretes?\u003c\/li\u003e \u003cli\u003eHow are integrated passives designed?\u003c\/li\u003e \u003cli\u003eWhat must be considered in the economic analysis?\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eIntegrated Passive Component Technology is the first book dedicated to this subject. A comprehensive survey of the state of the art, it will be an invaluable resource for engineers and materials scientists in the microelectronics industry. Interdisciplinary issues are presented in clearly delineated sections throughout the book so readers can pick those parts that are most beneficial to them.\u003c\/p\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Default Title","offer_id":47989436678373,"sku":"NP9780471244318","price":184.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9780471244318.jpg?v=1761784095","url":"https:\/\/k12savings.com\/products\/integrated-passive-component-technology-isbn-9780471244318","provider":"K12savings","version":"1.0","type":"link"}