{"product_id":"electronics-manufacturing-with-lead-free-halogen-free-and-conductive-adhesive-materials-isbn-9780071386241","title":"Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials","description":"\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, \u003cspan\u003e    \u003c\/span\u003eauthenticity, or access to any online entitlements included with the product.\u003c\/b\u003e\u003cbr\u003e\u003cb\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\u003cbr\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\u003cbr\u003eELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS\u003c\/b\u003e\u003cp\u003eThis comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.\u003c\/p\u003e\u003cp\u003eWritten for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e* Chip (wafer) level interconnects with lead-free solder bumps\u003cbr\u003e* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods\u003cbr\u003e* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates\u003cbr\u003e* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs\u003cbr\u003e* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB\/substrate\u003cbr\u003e* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages\u003cbr\u003e* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging\u003cbr\u003e* Environmental issues for conventional PCBs and substrates\u003cbr\u003e* Some environmentally conscious flame-retardants for PCBs and organic substrates\u003cbr\u003e* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety\u003cbr\u003e* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives\u003cbr\u003e* Criteria, development approaches, and varieties of alloys and properties of lead-free solders\u003cbr\u003e* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders\u003cbr\u003e* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications\u003cbr\u003e* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process\u003cbr\u003e* Fundamental understanding of electrically conductive adhesive (ECA) technology\u003cbr\u003e* Effects of lubricant removal and cure shrinkage on ECAs\u003cbr\u003e* Mechanisms underlying the contact resistance shifts of ECAs\u003cbr\u003e* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs\u003cbr\u003e* Stabilization of contact resistance of ECAs using various additives\u003c\/p\u003e","brand":"McGraw Hill","offers":[{"title":"New","offer_id":44818889507045,"sku":"NP9780071386241","price":162.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9780071386241.jpg?v=1710199991","url":"https:\/\/k12savings.com\/products\/electronics-manufacturing-with-lead-free-halogen-free-and-conductive-adhesive-materials-isbn-9780071386241","provider":"K12savings","version":"1.0","type":"link"}