{"product_id":"polymeric-materials-for-electronic-packaging-isbn-9781394188796","title":"Polymeric Materials for Electronic Packaging","description":"\u003cb\u003ePOLYMERIC MATERIALS FOR ELECTRONIC PACKAGING\u003c\/b\u003e \u003cp\u003e\u003cb\u003eCreate and deploy reliable polymeric materials for use in electronic products with this comprehensive guide\u003c\/b\u003e \u003c\/p\u003e\u003cp\u003eModern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. \u003c\/p\u003e\u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003eis designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. \u003c\/p\u003e\u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003ereaders will also find: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDetailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more\u003c\/li\u003e \u003cli\u003eAnalysis uniquely suited to the dimensions of cutting-edge semiconductor technology\u003c\/li\u003e \u003cli\u003eIncorporation of cutting-edge viscoelasticity analysis software, available separately from the author\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003eis critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas. \u003c\/p\u003e\u003cp\u003eAbout the Author ix\u003c\/p\u003e \u003cp\u003ePreface xi\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Basics of Semiconductor 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Development of Semiconductors 1\u003c\/p\u003e \u003cp\u003e1.2 Analysis of Semiconductors Materials 5\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Basics of Polymer Materials 9\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Polymer Material 9\u003c\/p\u003e \u003cp\u003e2.2 Types and Classification of Polymer Materials 10\u003c\/p\u003e \u003cp\u003e2.3 General Properties of Polymer Materials 12\u003c\/p\u003e \u003cp\u003e2.4 Summary 13\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Basics of Elastic Theory 15\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Elasticity 15\u003c\/p\u003e \u003cp\u003e3.2 Stress and Strain 15\u003c\/p\u003e \u003cp\u003e3.3 Finite Element Method Analysis (FEM Analysis) 16\u003c\/p\u003e \u003cp\u003e3.4 Governing Equation of Elastic Body 18\u003c\/p\u003e \u003cp\u003e3.5 Law of Elastic Breakage 19\u003c\/p\u003e \u003cp\u003e3.6 Plane Stress and Plane Strain 21\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Stress Evaluations with Defects 23\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Difference from Strength of Materials 23\u003c\/p\u003e \u003cp\u003e4.2 Stress Concentration and Stress Intensity Factor 24\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Basics of Viscoelasticity 27\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 About Viscoelasticity 27\u003c\/p\u003e \u003cp\u003e5.2 Elasticity, Viscosity, and Viscoelasticity 28\u003c\/p\u003e \u003cp\u003e5.3 Stress and Strain Response 29\u003c\/p\u003e \u003cp\u003e5.4 Mechanical Model Representing Viscoelastic Properties 32\u003c\/p\u003e \u003cp\u003e5.5 Conceptual Formula for Creep and Stress Relaxation 35\u003c\/p\u003e \u003cp\u003e5.6 Master Curve and Time-Temperature Conversion Rule 38\u003c\/p\u003e \u003cp\u003e5.7 Approximation of Master Curve 39\u003c\/p\u003e \u003cp\u003e5.8 Superposition Principle and Basic Equations 40\u003c\/p\u003e \u003cp\u003e5.9 Simple Model of Generating Thermal Stress and Strain 41\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Measurement of Viscoelastic Properties 43\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Dynamic Viscoelasticity 43\u003c\/p\u003e \u003cp\u003e6.2 Measurement Method 43\u003c\/p\u003e \u003cp\u003e6.3 Complex Modulus and Mechanical Model 44\u003c\/p\u003e \u003cp\u003e6.4 Dispersion and Absorption by Frequency 46\u003c\/p\u003e \u003cp\u003e6.5 Actual Measurement Example 48\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Design Issues of LSI Packages 49\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 49\u003c\/p\u003e \u003cp\u003e7.2 Trends and Issues of LSI Packages 51\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Validity of Viscoelastic Analysis 55\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 55\u003c\/p\u003e \u003cp\u003e8.2 Structure of Laminated Body 56\u003c\/p\u003e \u003cp\u003e8.3 Analysis Method 61\u003c\/p\u003e \u003cp\u003e8.4 Cooling Experiment of Laminated Body 61\u003c\/p\u003e \u003cp\u003e8.5 Analysis Results and Experimental Values 63\u003c\/p\u003e \u003cp\u003e8.6 Conclusion 67\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Application to CSP-μBGA 69\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 69\u003c\/p\u003e \u003cp\u003e9.2 Structure and Modeling of CSP-μBGA 69\u003c\/p\u003e \u003cp\u003e9.3 Material Property Values Used for Analysis 70\u003c\/p\u003e \u003cp\u003e9.4 Material and Structure Optimization Design by VESAP Analysis 73\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Thermal Stress and Warpage Behavior During Cooling Process of Three-Layer Laminate 79\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 79\u003c\/p\u003e \u003cp\u003e10.2 Structure of LSI Package 79\u003c\/p\u003e \u003cp\u003e10.3 Three-Layer Viscoelastic Laminate Model 80\u003c\/p\u003e \u003cp\u003e10.4 Elucidation of Warpage Deformation Behavior by VESAP Analysis 81\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Warp Deformation Behavior From Heating to Cooling 91\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 91\u003c\/p\u003e \u003cp\u003e11.2 Two-Layer Laminate With Epoxy Resin\/FR-4 Substrate 92\u003c\/p\u003e \u003cp\u003e11.3 Two-Layer Laminate with Epoxy Resin\/Steel 101\u003c\/p\u003e \u003cp\u003e11.4 Three-Layer Laminate with Steel\/Epoxy Resin\/Printed Board 104\u003c\/p\u003e \u003cp\u003e11.5 Analysis Experiment of Four-Layer Laminate 108\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Deformation Prediction Method Considering Curing Shrinkage of Resin 119\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 119\u003c\/p\u003e \u003cp\u003e12.2 Examination the Procedure and the Way of Thinking 120\u003c\/p\u003e \u003cp\u003e12.3 Contents of VESAP Analysis 122\u003c\/p\u003e \u003cp\u003e12.4 Simple Prediction Formula for Calculating Curing Warpage 123\u003c\/p\u003e \u003cp\u003e12.5 Warp Deformation Experiment 128\u003c\/p\u003e \u003cp\u003e12.6 Theoretical Prediction of Warpage Deformation due to Hardening and Heat 130\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Changes in Material Properties and Deformation Behavior Due to Thermal Degradation 133\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 Purpose and Background 133\u003c\/p\u003e \u003cp\u003e13.2 Experimental Case I 134\u003c\/p\u003e \u003cp\u003e13.3 Experiment of Case II 139\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 Simple Evaluation Method for Deformation of Viscoelastic Body 147\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e14.1 Introduction 147\u003c\/p\u003e \u003cp\u003e14.2 Derivation of Simple Formula 147\u003c\/p\u003e \u003cp\u003e14.3 Practical Method 151\u003c\/p\u003e \u003cp\u003e14.4 Determining the Curing Temperature of the Resin 152\u003c\/p\u003e \u003cp\u003e14.5 Effect of Epoxy Resin Thickness on Heat Generation Temperature 153\u003c\/p\u003e \u003cp\u003e14.6 Conclusion 156\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 Effect of Cooling Rate on Warpage Behavior of Laminates 159\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e15.1 Warp Deformation Experiment 159\u003c\/p\u003e \u003cp\u003e15.2 VESAP Analysis 160\u003c\/p\u003e \u003cp\u003e15.3 Results and Considerations 163\u003c\/p\u003e \u003cp\u003e15.4 Final Warp Deformation and Residual Warp Deformation 166\u003c\/p\u003e \u003cp\u003e15.5 Estimation Mechanism Between Cooling Rate and Deformation of Laminate 168\u003c\/p\u003e \u003cp\u003e15.6 Conclusion 169\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix A Development of Viscoelastic Analysis Software (VESAP) 171\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eA.1 Development Needs and Concepts 171\u003c\/p\u003e \u003cp\u003eA.2 Derivation of Basic Formula for Analysis 172\u003c\/p\u003e \u003cp\u003eA.3 Contents of the Developed VESAP Software 175\u003c\/p\u003e \u003cp\u003eBibliography 179\u003c\/p\u003e \u003cp\u003eIndex 185\u003c\/p\u003e  \u003cp\u003e\u003cb\u003eShozo Nakamura, PhD, \u003c\/b\u003eis Professor Emeritus at the Hiroshima Institute of Technology, Japan, and a sought-after corporate technical adviser. In 2019, he established the Nakamura Technical Research Institute.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003eCreate and deploy reliable polymeric materials for use in electronic products with this comprehensive guide\u003c\/b\u003e \u003c\/p\u003e\u003cp\u003eModern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. \u003c\/p\u003e\u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003eis designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. \u003c\/p\u003e\u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003ereaders will also find: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDetailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more\u003c\/li\u003e \u003cli\u003eAnalysis uniquely suited to the dimensions of cutting-edge semiconductor technology\u003c\/li\u003e \u003cli\u003eIncorporation of cutting-edge viscoelasticity analysis software, available separately from the author\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003eis critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.\u003c\/p\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Default Title","offer_id":47989812297957,"sku":"NP9781394188796","price":150.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9781394188796.jpg?v=1761785551","url":"https:\/\/k12savings.com\/es\/products\/polymeric-materials-for-electronic-packaging-isbn-9781394188796","provider":"K12savings","version":"1.0","type":"link"}