{"product_id":"modern-electroplating-isbn-9780470167786","title":"Modern Electroplating","description":"\u003cp\u003e\u003cb\u003eThe definitive resource for electroplating, now completely up to date\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eWith advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of \u003ci\u003eModern Electroplating\u003c\/i\u003e was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers.\u003c\/p\u003e \u003cp\u003eWith special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the \u003ci\u003eFifth Edition\u003c\/i\u003e boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes:\u003c\/p\u003e \u003cul\u003e \u003cli\u003eEasily accessible, self-contained contributions by over thirty experts\u003c\/li\u003e \u003cli\u003eFive completely new chapters and hundreds of additional pages\u003c\/li\u003e \u003cli\u003eA cutting-edge look at applications in nanoelectronics\u003c\/li\u003e \u003cli\u003eCoverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM)\u003c\/li\u003e \u003cli\u003eAn important discussion of the physical properties of metal thin films\u003c\/li\u003e \u003cli\u003eChapters devoted to methods, tools, control, and environmental issues\u003c\/li\u003e \u003cli\u003eAnd much more\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eA must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.\u003c\/p\u003e \u003cp\u003ePreface vii\u003c\/p\u003e \u003cp\u003ePreface to the Fourth Edition ix\u003c\/p\u003e \u003cp\u003eContributors xi\u003c\/p\u003e \u003cp\u003eConversion Factors xiii\u003c\/p\u003e \u003cp\u003eGraphical Conversions xv\u003c\/p\u003e \u003cp\u003eThe Electrochemical Society Series xvii\u003c\/p\u003e \u003cp\u003e1 Fundamental Considerations 1\u003cbr\u003e \u003ci\u003eMilan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2 Electrodeposition of Copper 33\u003cbr\u003e \u003ci\u003eJack W. Dini and Dexter D. Snyder\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3 Electrodeposition of Nickel 79\u003cbr\u003e \u003ci\u003eGeorge A. Di Bari\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4 Electrodeposition of Gold 115\u003cbr\u003e \u003ci\u003ePaul A. Kohl\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5 Electroless and Electrodeposition of Silver 131\u003cbr\u003e \u003ci\u003eMordechay Schlesinger\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6 Tin and Tin Alloys for Lead-Free Solder 139\u003cbr\u003e \u003ci\u003eYun Zhang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7 Electrodeposition of Chromium 205\u003cbr\u003e \u003ci\u003eNenad V. Mandich and Donald L. Snyder\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8 Electrodeposition of Lead and Lead Alloys 249\u003cbr\u003e \u003ci\u003eManfred Jordan\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9 Electrodeposition of Tin–Lead Alloys 265\u003cbr\u003e \u003ci\u003eManfred Jordan\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10 Electrodeposition of Zinc and Zinc Alloys 285\u003cbr\u003e \u003ci\u003eRené Winand\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11 Electrodeposition of Iron and Iron Alloys 309\u003cbr\u003e \u003ci\u003eMasanobu Izaki\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e12 Palladium Electroplating 327\u003cbr\u003e \u003ci\u003eJoseph A. Abys\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e13 Electrochemical Deposition Process for ULSI Interconnection Devices 369\u003cbr\u003e \u003ci\u003eTetsuya Osaka and Masahiro Yoshino\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e14 Electrodeposition of Semiconductors 383\u003cbr\u003e \u003ci\u003eT. E. Schlesinger, Krishnan Rajeshwar, and Norma R. De Tacconi\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e15 Deposition on Nonconductors 413\u003cbr\u003e \u003ci\u003eMordechay Schlesinger\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e16 Conductive Polymers: Electroplating of Organic Films 421\u003cbr\u003e \u003ci\u003eTetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e17 Electroless Deposition of Copper 433\u003cbr\u003e \u003ci\u003eMilan Paunovic\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e18 Electroless Deposition of Nickel 447\u003cbr\u003e \u003ci\u003eMordechay Schlesinger\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems 459\u003cbr\u003e \u003ci\u003eAtsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e20 Electroless Deposition of Palladium and Platinum 477\u003cbr\u003e \u003ci\u003eIzumi Ohno\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e21 Electroless Deposition of Gold 483\u003cbr\u003e \u003ci\u003eYutaka Okinaka and Masaru Kato\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e22 Electroless Deposition of Alloys 499\u003cbr\u003e \u003ci\u003eIzumi Ohno\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e23 Preparation for Deposition 507\u003cbr\u003e \u003ci\u003eDexter D. Snyder\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e24 Manufacturing Tools 513\u003cbr\u003e \u003ci\u003eTom Ritzdorf\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e25 Monitoring and Control 527\u003cbr\u003e \u003ci\u003eTom Ritzdorf\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e26 Environmental Aspects of Electrodeposition 555\u003cbr\u003e \u003ci\u003eMicha Tomkiewicz\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e27 Applications to Magnetic Recording and Microelectronic Technologies 573\u003cbr\u003e \u003ci\u003eStanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e28 Microelectromechanical Systems 617\u003cbr\u003e \u003ci\u003eGiovanni Zangari\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e29 Analysis of Electroplated Films Using Dual-Beam FIB\/SEM and TEM Techniques 637\u003cbr\u003e \u003ci\u003eXianying Meng-Burany\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates 665\u003cbr\u003e \u003ci\u003eRobert Petro, Mordechay Schlesinger, and Guang-Ling Song\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eAppendix 687\u003c\/p\u003e \u003cp\u003eIndex 701\u003c\/p\u003e \"This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical , the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject.\" (Digital Post Production, 23 November 2010)\u003cbr\u003e \u003cbr\u003e \u003cp\u003e\"With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject\". (GNT, 23 November 2010)\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e'This will be a very long-lasting popular reference book, now in it's 5th edition. (IEEE Electrical insulation magazine 2016)\u003c\/p\u003e \u003cp\u003e\u003cb\u003eMORDECHAY SCHLESINGER\u003c\/b\u003e, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He has published over 120 research papers, holds four patents, and has served as associate editor for the \u003ci\u003eJournal of The Electrochemical Society\u003c\/i\u003e, \u003ci\u003eElectrochemical and Solid-State Letters\u003c\/i\u003e, and as coeditor of the \u003ci\u003eCanadian Journal of Physics\u003c\/i\u003e. Schlesinger is coauthor, with Milan Paunovic, of the first and second editions of \u003ci\u003eFundamentals of Electrochemical Deposition\u003c\/i\u003e and the previous edition of \u003ci\u003eModern Electroplating\u003c\/i\u003e (both by Wiley).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eMILAN PAUNOVIC\u003c\/b\u003e, PhD, had, until his recent retirement, worked on electrochemical metal deposition for over four decades, most recently in the Electrodeposition Technology Department at IBM's T. J. Watson Research Center, and previously at the University of Pennsylvania, Reynolds Metals, Kollmorgen, and Intel. In addition to coauthoring, with Mordechay Schlesinger, the first and second editions of \u003ci\u003eFundamentals of Electrochemical Deposition\u003c\/i\u003e and the previous edition of \u003ci\u003eModern Electroplating\u003c\/i\u003e, Dr. Paunovic has edited symposia proceedings for The Electrochemical Society, published forty-one research papers, and holds seven patents.\u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47989640855781,"sku":"NP9780470167786","price":194.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9780470167786.jpg?v=1761784922","url":"https:\/\/k12savings.com\/es\/products\/modern-electroplating-isbn-9780470167786","provider":"K12savings","version":"1.0","type":"link"}