{"product_id":"mechanics-of-microsystems-isbn-9781119053835","title":"Mechanics of Microsystems","description":"\u003cp\u003e\u003cb\u003eMechanics of Microsystems\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eAlberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003e\u003cb\u003e\u003ci\u003eA mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability\u003c\/i\u003e\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003e\u003ci\u003eMechanics of Microsystems\u003c\/i\u003e takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry.\u003c\/p\u003e \u003cp\u003e\u003ci\u003eMechanics of Microsystems\u003c\/i\u003e is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device.\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003eKey features:\u003c\/p\u003e \u003cul\u003e \u003cli\u003eProvides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues.\u003c\/li\u003e \u003cli\u003eIncludes examples of applications in industry.\u003c\/li\u003e \u003cli\u003eAccompanied by a website hosting supplementary material.\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003eThe book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.\u003c\/p\u003e \u003cp\u003eSeries Preface xiii\u003c\/p\u003e \u003cp\u003ePreface xv\u003c\/p\u003e \u003cp\u003eAcknowledgements xvii\u003c\/p\u003e \u003cp\u003eNotation xix\u003c\/p\u003e \u003cp\u003eAbout the Companion Websitexxiii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Microsystems 1\u003c\/p\u003e \u003cp\u003e1.2 Microsystems Fabrication 3\u003c\/p\u003e \u003cp\u003e1.3 Mechanics in Microsystems 5\u003c\/p\u003e \u003cp\u003e1.4 Book Contents 6\u003c\/p\u003e \u003cp\u003eReferences 7\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart I Fundamentals 9\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Fundamentals of Mechanics and Coupled Problems 11\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 11\u003c\/p\u003e \u003cp\u003e2.2 Kinematics and Dynamics of Material Points and Rigid Bodies 12\u003c\/p\u003e \u003cp\u003e2.2.1 Basic Notions of Kinematics and Motion Composition 12\u003c\/p\u003e \u003cp\u003e2.2.2 Basic Notions of Dynamics and Relative Dynamics 15\u003c\/p\u003e \u003cp\u003e2.2.3 One-Degree-of-Freedom Oscillator 17\u003c\/p\u003e \u003cp\u003e2.2.4 Rigid-Body Kinematics and Dynamics 22\u003c\/p\u003e \u003cp\u003e2.3 Solid Mechanics 25\u003c\/p\u003e \u003cp\u003e2.3.1 Linear Elastic Problem for Deformable Solids 26\u003c\/p\u003e \u003cp\u003e2.3.2 Linear Elastic Problem for Beams 35\u003c\/p\u003e \u003cp\u003e2.4 Fluid Mechanics 43\u003c\/p\u003e \u003cp\u003e2.4.1 Navier–Stokes Equations 43\u003c\/p\u003e \u003cp\u003e2.4.2 Fluid–Structure Interaction 48\u003c\/p\u003e \u003cp\u003e2.5 Electrostatics and Electromechanics 49\u003c\/p\u003e \u003cp\u003e2.5.1 Basic Notions of Electrostatics 49\u003c\/p\u003e \u003cp\u003e2.5.2 Simple Electromechanical Problem 54\u003c\/p\u003e \u003cp\u003e2.5.3 General Electromechanical Coupled Problem 58\u003c\/p\u003e \u003cp\u003e2.6 Piezoelectric Materials in Microsystems 60\u003c\/p\u003e \u003cp\u003e2.6.1 Piezoelectric Materials 60\u003c\/p\u003e \u003cp\u003e2.6.2 Piezoelectric Modelling 62\u003c\/p\u003e \u003cp\u003e2.7 Heat Conduction and Thermomechanics 64\u003c\/p\u003e \u003cp\u003e2.7.1 Heat Problem 64\u003c\/p\u003e \u003cp\u003e2.7.2 Thermomechanical Coupled Problem 67\u003c\/p\u003e \u003cp\u003eReferences 70\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Modelling of Linear and Nonlinear Mechanical Response 73\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 73\u003c\/p\u003e \u003cp\u003e3.2 Fundamental Principles 74\u003c\/p\u003e \u003cp\u003e3.2.1 Principle of Virtual Power 74\u003c\/p\u003e \u003cp\u003e3.2.2 Total Potential Energy Principle 74\u003c\/p\u003e \u003cp\u003e3.2.3 Hamilton’s Principle 75\u003c\/p\u003e \u003cp\u003e3.2.4 Specialization of the Principle of Virtual Powers to Beams 76\u003c\/p\u003e \u003cp\u003e3.3 Approximation Techniques and Weighted Residuals Approach 76\u003c\/p\u003e \u003cp\u003e3.4 Exact and Approximate Solutions for Dynamic Problems 79\u003c\/p\u003e \u003cp\u003e3.4.1 Free Flexural Linear Vibrations of a Single-span Beam 79\u003c\/p\u003e \u003cp\u003e3.4.2 Nonlinear Vibration of an Axially Loaded Beam 80\u003c\/p\u003e \u003cp\u003e3.5 Example of Application: Bistable Elements 84\u003c\/p\u003e \u003cp\u003eReferences 90\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart II Devices 91\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Accelerometers 93\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 93\u003c\/p\u003e \u003cp\u003e4.2 Capacitive Accelerometers 94\u003c\/p\u003e \u003cp\u003e4.2.1 In-Plane Sensing 94\u003c\/p\u003e \u003cp\u003e4.2.2 Out-of-Plane Sensing 96\u003c\/p\u003e \u003cp\u003e4.3 Resonant Accelerometers 98\u003c\/p\u003e \u003cp\u003e4.3.1 Resonating Proof Mass 98\u003c\/p\u003e \u003cp\u003e4.3.2 Resonating Elements Coupled to the Proof Mass 99\u003c\/p\u003e \u003cp\u003e4.4 Examples 101\u003c\/p\u003e \u003cp\u003e4.4.1 Three-Axis Capacitive Accelerometer 101\u003c\/p\u003e \u003cp\u003e4.4.2 Out-of-Plane Resonant Accelerometer 104\u003c\/p\u003e \u003cp\u003e4.4.3 In-Plane Resonant Accelerometer 105\u003c\/p\u003e \u003cp\u003e4.5 Design Problems and Reliability Issues 107\u003c\/p\u003e \u003cp\u003eReferences 107\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Coriolis-Based Gyroscopes 109\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction 109\u003c\/p\u003e \u003cp\u003e5.2 Basic Working Principle 109\u003c\/p\u003e \u003cp\u003e5.2.1 Sensitivity of Coriolis Vibratory Gyroscopes 112\u003c\/p\u003e \u003cp\u003e5.3 Lumped-Mass Gyroscopes 113\u003c\/p\u003e \u003cp\u003e5.3.1 Symmetric and Decoupled Gyroscope 113\u003c\/p\u003e \u003cp\u003e5.3.2 Tuning-Fork Gyroscope 114\u003c\/p\u003e \u003cp\u003e5.3.3 Three-Axis Gyroscope 115\u003c\/p\u003e \u003cp\u003e5.3.4 Gyroscopes with Resonant Sensing 115\u003c\/p\u003e \u003cp\u003e5.4 Disc and Ring Gyroscopes 118\u003c\/p\u003e \u003cp\u003e5.5 Design Problems and Reliability Issues 118\u003c\/p\u003e \u003cp\u003eReferences 119\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Resonators 121\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction 121\u003c\/p\u003e \u003cp\u003e6.2 Electrostatically Actuated Resonators 123\u003c\/p\u003e \u003cp\u003e6.3 Piezoelectric Resonators 125\u003c\/p\u003e \u003cp\u003e6.4 Nonlinearity Issues 126\u003c\/p\u003e \u003cp\u003eReferences 128\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Micromirrors and Parametric Resonance 131\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 131\u003c\/p\u003e \u003cp\u003e7.2 Electrostatic Resonant Micromirror 132\u003c\/p\u003e \u003cp\u003e7.2.1 Numerical Simulations with a Continuation Approach 136\u003c\/p\u003e \u003cp\u003e7.2.2 Experimental Set-Up 140\u003c\/p\u003e \u003cp\u003eReferences 145\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Vibrating Lorentz Force Magnetometers 147\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 147\u003c\/p\u003e \u003cp\u003e8.2 Vibrating Lorentz Force Magnetometers 148\u003c\/p\u003e \u003cp\u003e8.2.1 Classical Devices 148\u003c\/p\u003e \u003cp\u003e8.2.2 Improved Design 151\u003c\/p\u003e \u003cp\u003e8.2.3 Further Improvements 155\u003c\/p\u003e \u003cp\u003e8.3 Topology or Geometry Optimization 156\u003c\/p\u003e \u003cp\u003eReferences 159\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Mechanical Energy Harvesters 161\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 161\u003c\/p\u003e \u003cp\u003e9.2 Inertial Energy Harvesters 162\u003c\/p\u003e \u003cp\u003e9.2.1 Classification of Resonant Energy Harvesters 162\u003c\/p\u003e \u003cp\u003e9.2.2 Mechanical Model of a Simple Piezoelectric Harvester 165\u003c\/p\u003e \u003cp\u003e9.3 Frequency Upconversion and Bistability 174\u003c\/p\u003e \u003cp\u003e9.4 Fluid–Structure Interaction Energy Harvesters 176\u003c\/p\u003e \u003cp\u003e9.4.1 Synopsis of Aeroelastic Phenomena 177\u003c\/p\u003e \u003cp\u003e9.4.2 Energy Harvesting through Vortex-Induced Vibration 179\u003c\/p\u003e \u003cp\u003e9.4.3 Energy Harvesting through Flutter Instability 180\u003c\/p\u003e \u003cp\u003eReferences 181\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Micropumps 185\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 185\u003c\/p\u003e \u003cp\u003e10.2 Modelling Issues for Diaphragm Micropumps 186\u003c\/p\u003e \u003cp\u003e10.3 Modelling of Electrostatic Actuator 188\u003c\/p\u003e \u003cp\u003e10.3.1 Simplified Electromechanical Model 188\u003c\/p\u003e \u003cp\u003e10.3.2 Reliability Issues 192\u003c\/p\u003e \u003cp\u003e10.4 Multiphysics Model of an Electrostatic Micropump 196\u003c\/p\u003e \u003cp\u003e10.5 Piezoelectric Micropumps 198\u003c\/p\u003e \u003cp\u003e10.5.1 Modelling of the Actuator 198\u003c\/p\u003e \u003cp\u003e10.5.2 Complete Multiphysics Model 201\u003c\/p\u003e \u003cp\u003eReferences 202\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart III Reliability and Dissipative Phenomena 205\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Mechanical Characterization at the Microscale 207\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 207\u003c\/p\u003e \u003cp\u003e11.2 Mechanical Characterization of Polysilicon as a Structural Material for Microsystems 209\u003c\/p\u003e \u003cp\u003e11.2.1 Polysilicon as a Structural Material for Microsystems 209\u003c\/p\u003e \u003cp\u003e11.2.2 Testing Methodologies 210\u003c\/p\u003e \u003cp\u003e11.2.3 Quasi-Static Testing 211\u003c\/p\u003e \u003cp\u003e11.2.4 High-Frequency Testing 214\u003c\/p\u003e \u003cp\u003e11.3 Weibull Approach 215\u003c\/p\u003e \u003cp\u003e11.4 On-Chip Testing Methodology for Experimental Determination of Elastic Stiffness and Nominal Strength 219\u003c\/p\u003e \u003cp\u003e11.4.1 On-Chip Bending Test through a Comb-Finger Rotational Electrostatic Actuator 220\u003c\/p\u003e \u003cp\u003e11.4.2 On-Chip Bending Test through a Parallel-Plate Electrostatic Actuator 225\u003c\/p\u003e \u003cp\u003e11.4.3 On-Chip Tensile Test through an Electrothermomechanical Actuator 229\u003c\/p\u003e \u003cp\u003e11.4.4 On-Chip Test for Thick Polysilicon Films 233\u003c\/p\u003e \u003cp\u003eReferences 240\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Fracture and Fatigue in Microsystems 245\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 245\u003c\/p\u003e \u003cp\u003e12.2 Fracture Mechanics: An Overview 245\u003c\/p\u003e \u003cp\u003e12.3 MEMS Failure Modes due to Cracking 249\u003c\/p\u003e \u003cp\u003e12.3.1 Cracking and Delamination at Package Level 249\u003c\/p\u003e \u003cp\u003e12.3.2 Cracking at Silicon Film Level 250\u003c\/p\u003e \u003cp\u003e12.4 Fatigue in Microsystems 256\u003c\/p\u003e \u003cp\u003e12.4.1 An Introduction to Fatigue in Mechanics 256\u003c\/p\u003e \u003cp\u003e12.4.2 Polysilicon Fatigue 259\u003c\/p\u003e \u003cp\u003e12.4.3 Fatigue in Metals at the Microscale 261\u003c\/p\u003e \u003cp\u003e12.4.4 Fatigue Testing at the Microscale 263\u003c\/p\u003e \u003cp\u003eReferences 266\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Accidental Drop Impact 271\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 Introduction 271\u003c\/p\u003e \u003cp\u003e13.2 Single-Degree-of-Freedom Response to Drops 272\u003c\/p\u003e \u003cp\u003e13.3 Estimation of the Acceleration Peak Induced by an Accidental Drop 276\u003c\/p\u003e \u003cp\u003e13.4 A Multiscale Approach to Drop Impact Events 277\u003c\/p\u003e \u003cp\u003e13.4.1 Macroscale Level 277\u003c\/p\u003e \u003cp\u003e13.4.2 Mesoscale Level 279\u003c\/p\u003e \u003cp\u003e13.4.3 Microscale Level 279\u003c\/p\u003e \u003cp\u003e13.5 Results: Drop-Induced Failure of Inertial MEMS 280\u003c\/p\u003e \u003cp\u003eReferences 287\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 Fabrication-Induced Residual Stresses and Relevant Failures 291\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e14.1 Main Sources of Residual Stresses in Microsystems 291\u003c\/p\u003e \u003cp\u003e14.2 The Stoney Formula and its Modifications 292\u003c\/p\u003e \u003cp\u003e14.3 Experimental Methods for the Evaluation of Residual Stresses 299\u003c\/p\u003e \u003cp\u003e14.4 Delamination, Buckling and Cracks in Thin Films due to Residual Stresses 304\u003c\/p\u003e \u003cp\u003eReferences 310\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 Damping in Microsystems 313\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e15.1 Introduction 313\u003c\/p\u003e \u003cp\u003e15.2 Gas Damping in the Continuum Regime with Slip Boundary Conditions 314\u003c\/p\u003e \u003cp\u003e15.2.1 Experimental Validation at Ambient Pressure 317\u003c\/p\u003e \u003cp\u003e15.2.2 Effects of Decreasing Working Pressure 318\u003c\/p\u003e \u003cp\u003e15.3 Gas Damping in the Rarefied Regime 320\u003c\/p\u003e \u003cp\u003e15.3.1 Evaluation of Damping at Low Pressure using Kinetic Models 321\u003c\/p\u003e \u003cp\u003e15.3.2 Linearization of the BGK Model 323\u003c\/p\u003e \u003cp\u003e15.3.3 Numerical Implementation 324\u003c\/p\u003e \u003cp\u003e15.3.4 Application to MEMS 325\u003c\/p\u003e \u003cp\u003e15.4 Gas Damping in the Free-Molecule Regime 328\u003c\/p\u003e \u003cp\u003e15.4.1 Boundary Integral Equation Approach 328\u003c\/p\u003e \u003cp\u003e15.4.2 Experimental Validations 330\u003c\/p\u003e \u003cp\u003e15.5 Solid Damping: Thermoelasticity 335\u003c\/p\u003e \u003cp\u003e15.6 Solid Damping: Anchor Losses 338\u003c\/p\u003e \u003cp\u003e15.6.1 Analytical Estimation of Dissipation 339\u003c\/p\u003e \u003cp\u003e15.6.2 Numerical Estimation of Anchor Losses 342\u003c\/p\u003e \u003cp\u003e15.7 Solid Damping: Additional unknown Sources – Surface Losses 346\u003c\/p\u003e \u003cp\u003e15.7.1 Solid Damping: Deviations from Thermoelasticity 346\u003c\/p\u003e \u003cp\u003e15.7.2 Solid Damping: Losses in Piezoresonators 346\u003c\/p\u003e \u003cp\u003eReferences 348\u003c\/p\u003e \u003cp\u003e\u003cb\u003e16 Surface Interactions 351\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e16.1 Introduction 351\u003c\/p\u003e \u003cp\u003e16.2 Spontaneous Adhesion or Stiction 352\u003c\/p\u003e \u003cp\u003e16.3 Adhesion Sources 353\u003c\/p\u003e \u003cp\u003e16.3.1 Capillary Attraction 353\u003c\/p\u003e \u003cp\u003e16.3.2 Van der Waals Interactions 356\u003c\/p\u003e \u003cp\u003e16.3.3 Casimir Forces 358\u003c\/p\u003e \u003cp\u003e16.3.4 Hydrogen Bonds 359\u003c\/p\u003e \u003cp\u003e16.3.5 Electrostatic Forces 360\u003c\/p\u003e \u003cp\u003e16.4 Experimental Characterization 361\u003c\/p\u003e \u003cp\u003e16.4.1 Experiments by Mastrangelo and Hsu 361\u003c\/p\u003e \u003cp\u003e16.4.2 Experiments by the Sandia Group 362\u003c\/p\u003e \u003cp\u003e16.4.3 Experiments by the Virginia Group 365\u003c\/p\u003e \u003cp\u003e16.4.4 Peel Experiments 367\u003c\/p\u003e \u003cp\u003e16.4.5 Pull-in Experiments 368\u003c\/p\u003e \u003cp\u003e16.4.6 Tests for Sidewall Adhesion 372\u003c\/p\u003e \u003cp\u003e16.5 Modelling and Simulation 374\u003c\/p\u003e \u003cp\u003e16.5.1 Lennard-Jones Potential 374\u003c\/p\u003e \u003cp\u003e16.5.2 Tribological Models: Hertz, JKR, DMT 375\u003c\/p\u003e \u003cp\u003e16.5.3 Computation of Adhesion Energy 377\u003c\/p\u003e \u003cp\u003e16.6 Recent Advances 380\u003c\/p\u003e \u003cp\u003e16.6.1 Finite Element Analysis of Adhesion between Rough Surfaces 380\u003c\/p\u003e \u003cp\u003e16.6.2 Accelerated Numerical Techniques 383\u003c\/p\u003e \u003cp\u003eReferences 387\u003c\/p\u003e \u003cp\u003eIndex 393\u003c\/p\u003e   \u003cp\u003e\u003cb\u003e Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi, and Stefano Mariani\u003c\/b\u003e\u003ci\u003e – Politecnico di Milano, Italy \u003c\/i\u003e  \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Alberto Corigliano\u003c\/b\u003e is a Professor of Solid and Structural Mechanics at the Department of Civil and Environmental Engineering of Politecnico di Milano, Italy. A. Corigliano has authored and co-authored more than 240 scientific publications in fields related to solid and structural mechanics at various scales, including 2 book chapters in Microsystems area, and 7 patents on Microsystems. During his research activity, A. Corigliano covered a wide range of subjects in the fields of structural and materials mechanics, with particular reference to theoretical and computational problems relevant to non-linear material responses.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Raffaele Ardito\u003c\/b\u003e is an Associate Professor of Solid and Structural Mechanics at the Department of Civil and Environmental Engineering of Politecnico di Milano, Italy. He graduated in 2000 (cum laude) at the Politecnico di Milano in Civil Engineering and he received the Ph.D. degree, cum laude, in 2004. From 2004 to 2006 he was a research fellow at the National Institute for Nuclear Physics, joining an international research group with focus on solid mechanics in cryogenic conditions. He spent, in 2008 and 2010, two periods of research at the Research Laboratory of Electronics, Massachusetts Institute of Technology, as visiting scientist. His scientific contributions to the field of MEMS focus on theoretical and computational aspects of adhesion and multi-physics behavior.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Claudia Comi\u003c\/b\u003e is a Professor of Solid and Structural Mechanics at the Department of Civil and Environmental Engineering of Politecnico di Milano, Italy. C. Comi has authored and co-authored more than 140 scientific publications in various fields of solid and structural mechanics and 4 patents on Microsystems. Her main research interests concern theoretical and computational mechanics of materials and structures. Her research activities focus on damage and quasi-brittle fracture modelling, on instability phenomena and nonlocal models for elastoplastic and damaging one-phase and multi-phase materials, including functionally graded materials, and on design and reliability of MEMS.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Attilio Frangi\u003c\/b\u003e is a Professor of Solid and Structural Mechanics at the Department of Civil and Environmental Engineering of Politecnico di Milano, Italy. A. Frangi has authored and co-authored more than 150 scientific publications on issues of computational mechanics and micromechanics and 5 patents on Microsystems. He has co-edited one scientific monograph on the multi-physics simulation of MEMS and NEMS. The research interests of A. Frangi in the field of MEMS include: the design of new devices; the theoretical and numerical analysis of multi-physics phenomena; the analysis of non-linear phenomena in the dynamical response of MOEMS.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Aldo Ghisi\u003c\/b\u003e is an Assistant Professor of Solid and Structural Mechanics at the Department of Civil and Environmental Engineering of Politecnico di Milano, Italy. A. Ghisi has authored and co-authored more than 70 scientific publications on various subjects related to materials and structural mechanics. His research areas include multi-physics phenomena in micro\/nano structures, particularly related to mechanical simulation of drop impacts, fatigue in polysilicon, gas-solid interaction, study of wafer-to-wafer bonding. Besides microsystems, he is also involved in the numerical and experimental study of metallic alloys for cryogenic applications and in dam engineering.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Stefano Mariani\u003c\/b\u003e is an Associate Professor of Solid and Structural Mechanics at the Department of Civil and Environmental Engineering of Politecnico di Milano, Italy. S. Mariani has authored and co-authored about 170 scientific publications. His main research interests are: numerical simulations of ductile fracture in metals and quasi-brittle fracture in heterogeneous and functionally graded materials; extended finite element methods; calibration of constitutive models via extended and sigma-point Kalman filters; multi-scale solution methods for dynamic delamination in layered composites; reliability of MEMS subject to shocks and drops; structural health monitoring of composite structures through MEMS sensors.      \u003c\/p\u003e\u003cp\u003e\u003cb\u003e A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability \u003c\/b\u003e  \u003c\/p\u003e\u003cp\u003e\u003ci\u003e Mechanics of Microsystems\u003c\/i\u003e takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a 'design for reliability' point of view and includes examples of applications in industry.   \u003c\/p\u003e\u003cp\u003e\u003ci\u003e Mechanics of Microsystems\u003c\/i\u003e is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device.   \u003c\/p\u003e\u003cp\u003e\u003cb\u003e Key features: \u003c\/b\u003e  \u003c\/p\u003e\u003cul\u003e \u003cli\u003eProvides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues.\u003c\/li\u003e \u003cli\u003eIncludes examples of applications in industry.\u003c\/li\u003e \u003cli\u003eAccompanied by a website hosting supplementary material.\u003c\/li\u003e \u003c\/ul\u003e \u003cbr\u003e  \u003cp\u003e The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.\u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47989596651749,"sku":"NP9781119053835","price":141.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9781119053835.jpg?v=1761784746","url":"https:\/\/k12savings.com\/es\/products\/mechanics-of-microsystems-isbn-9781119053835","provider":"K12savings","version":"1.0","type":"link"}