{"product_id":"electronic-packaging-science-and-technology-isbn-9781119418313","title":"Electronic Packaging Science and Technology","description":"\u003cp\u003eMust-have reference on electronic packaging technology!\u003c\/p\u003e \u003cp\u003eThe electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs.  Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.\u003c\/p\u003e \u003cp\u003eThe first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003ePreface xi\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Introduction 1\u003c\/p\u003e \u003cp\u003e1.2 Impact of Moore’s Law on Si Technology 3\u003c\/p\u003e \u003cp\u003e1.3 5G Technology and AI Applications 4\u003c\/p\u003e \u003cp\u003e1.4 3D IC Packaging Technology 7\u003c\/p\u003e \u003cp\u003e1.5 Reliability Science and Engineering 11\u003c\/p\u003e \u003cp\u003e1.6 The Future of Electronic Packaging Technology 13\u003c\/p\u003e \u003cp\u003e1.7 Outline of the Book 14\u003c\/p\u003e \u003cp\u003eReferences 15\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart I 17\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Cu-to-Cu and Other Bonding Technologies in Electronic Packaging 19\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 19\u003c\/p\u003e \u003cp\u003e2.2 Wire Bonding 20\u003c\/p\u003e \u003cp\u003e2.3 Tape-Automated Bonding 23\u003c\/p\u003e \u003cp\u003e2.4 Flip-Chip Solder Joint Bonding 26\u003c\/p\u003e \u003cp\u003e2.5 Micro-Bump Bonding 32\u003c\/p\u003e \u003cp\u003e2.6 Cu-to-Cu Direct Bonding 35\u003c\/p\u003e \u003cp\u003e2.6.1 Critical Factors for Cu-to-Cu Bonding 36\u003c\/p\u003e \u003cp\u003e2.6.2 Analysis of Cu-to-Cu Bonding Mechanism 39\u003c\/p\u003e \u003cp\u003e2.6.3 Microstructures at the Cu-to-Cu Bonding Interface 46\u003c\/p\u003e \u003cp\u003e2.7 Hybrid Bonding 51\u003c\/p\u003e \u003cp\u003e2.8 Reliability – Electromigration and Temperature Cycling Tests 54\u003c\/p\u003e \u003cp\u003eProblems 56\u003c\/p\u003e \u003cp\u003eReferences 57\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Randomly-Oriented and (111) Uni-directionally-Oriented Nanotwin Copper 61\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 61\u003c\/p\u003e \u003cp\u003e3.2 Formation Mechanism of Nanotwin Cu 63\u003c\/p\u003e \u003cp\u003e3.3 In Situ Measurement of Stress Evolution During Nanotwin Deposition 67\u003c\/p\u003e \u003cp\u003e3.4 Electrodeposition of Randomly Oriented Nanotwinned Copper 69\u003c\/p\u003e \u003cp\u003e3.5 Formation of Unidirectionally (111)-oriented Nanotwin Copper 71\u003c\/p\u003e \u003cp\u003e3.6 Grain Growth in [111]-Oriented nt-Cu 75\u003c\/p\u003e \u003cp\u003e3.7 Uni-directional Growth of η-Cu 6 Sn 5 in Microbumps on (111) Oriented nt-Cu 77\u003c\/p\u003e \u003cp\u003e3.8 Low Thermal-Budget Cu-to-Cu Bonding Using [111]-Oriented nt-Cu 78\u003c\/p\u003e \u003cp\u003e3.9 Nanotwin Cu RDL for Fanout Package and 3D IC Integration 83\u003c\/p\u003e \u003cp\u003eProblems 86\u003c\/p\u003e \u003cp\u003eReferences 87\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Solid–Liquid Interfacial Diffusion Reaction (SLID) Between Copper and Solder 91\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 91\u003c\/p\u003e \u003cp\u003e4.2 Kinetics of Scallop-Type IMC Growth in SLID 93\u003c\/p\u003e \u003cp\u003e4.3 A Simple Model for the Growth of Mono-Size Hemispheres 95\u003c\/p\u003e \u003cp\u003e4.4 Theory of Flux-Driven Ripening 97\u003c\/p\u003e \u003cp\u003e4.5 Measurement of the Nano-channel Width Between Two Scallops 100\u003c\/p\u003e \u003cp\u003e4.6 Extremely Rapid Grain Growth in Scallop-Type Cu6Sn5 in Slid 100\u003c\/p\u003e \u003cp\u003eProblems 102\u003c\/p\u003e \u003cp\u003eReferences 103\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Solid-State Reactions Between Copper and Solder 105\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction 105\u003c\/p\u003e \u003cp\u003e5.2 Layer-Type Growth of IMC in Solid-State Reactions 106\u003c\/p\u003e \u003cp\u003e5.3 Wagner Diffusivity 111\u003c\/p\u003e \u003cp\u003e5.4 Kirkendall Void Formation in Cu 3 Sn 113\u003c\/p\u003e \u003cp\u003e5.5 Sidewall Reaction to Form Porous Cu 3 Sn in μ-Bumps 114\u003c\/p\u003e \u003cp\u003e5.6 Effect of Surface Diffusion on IMC Formation in Pillar-Type\u003c\/p\u003e \u003cp\u003eμ-Bumps 120\u003c\/p\u003e \u003cp\u003eProblems 124\u003c\/p\u003e \u003cp\u003eReferences 125\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart II 127\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Essence of Integrated Circuits and Packaging Design 129\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction 129\u003c\/p\u003e \u003cp\u003e6.2 Transistor and Interconnect Scaling 131\u003c\/p\u003e \u003cp\u003e6.3 Circuit Design and LSI 133\u003c\/p\u003e \u003cp\u003e6.4 System-on-Chip (SoC) and Multicore Architectures 139\u003c\/p\u003e \u003cp\u003e6.5 System-in-Package (SiP) and Package Technology Evolution 140\u003c\/p\u003e \u003cp\u003e6.6 3D IC Integration and 3D Silicon Integration 144\u003c\/p\u003e \u003cp\u003e6.7 Heterogeneous Integration: An Introduction 145\u003c\/p\u003e \u003cp\u003eProblems 146\u003c\/p\u003e \u003cp\u003eReferences 146\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Performance, Power, Thermal, and Reliability 149\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 149\u003c\/p\u003e \u003cp\u003e7.2 Field-Effect Transistor and Memory Basics 151\u003c\/p\u003e \u003cp\u003e7.3 Performance: A Race in Early IC Design 155\u003c\/p\u003e \u003cp\u003e7.4 Trend in Low Power 157\u003c\/p\u003e \u003cp\u003e7.5 Trade-off between Performance and Power 159\u003c\/p\u003e \u003cp\u003e7.6 Power Delivery and Clock Distribution Networks 160\u003c\/p\u003e \u003cp\u003e7.7 Low-Power Design Architectures 163\u003c\/p\u003e \u003cp\u003e7.8 Thermal Problems in IC and Package 166\u003c\/p\u003e \u003cp\u003e7.9 Signal Integrity and Power Integrity (SI\/PI) 168\u003c\/p\u003e \u003cp\u003e7.10 Robustness: Reliability and Variability 169\u003c\/p\u003e \u003cp\u003eProblems 171\u003c\/p\u003e \u003cp\u003eReferences 172\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 2.5D\/3D System-in-Packaging Integration 173\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 173\u003c\/p\u003e \u003cp\u003e8.2 2.5D IC: Redistribution Layer (RDL) and TSV-Interposer 174\u003c\/p\u003e \u003cp\u003e8.3 2.5D IC: Silicon, Glass, and Organic Substrates 176\u003c\/p\u003e \u003cp\u003e8.4 2.5D IC: HBM on Silicon Interposer 177\u003c\/p\u003e \u003cp\u003e8.5 3D IC: Memory Bandwidth Challenge for High-Performance Computing 178\u003c\/p\u003e \u003cp\u003e8.6 3D IC: Electrical and Thermal TSVs 180\u003c\/p\u003e \u003cp\u003e8.7 3D IC: 3D-Stacked Memory and Integrated Memory Controller 182\u003c\/p\u003e \u003cp\u003e8.8 Innovative Packaging for Modern Chips\/Chiplets 183\u003c\/p\u003e \u003cp\u003e8.9 Power Distribution for 3D IC Integration 186\u003c\/p\u003e \u003cp\u003e8.10 Challenge and Trend 187\u003c\/p\u003e \u003cp\u003eProblems 188\u003c\/p\u003e \u003cp\u003eReferences 188\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart III 191\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Irreversible Processes in Electronic Packaging Technology 193\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 193\u003c\/p\u003e \u003cp\u003e9.2 Flow in Open Systems 196\u003c\/p\u003e \u003cp\u003e9.3 Entropy Production 198\u003c\/p\u003e \u003cp\u003e9.3.1 Electrical Conduction 199\u003c\/p\u003e \u003cp\u003e9.3.1.1 Joule Heating 201\u003c\/p\u003e \u003cp\u003e9.3.2 Atomic Diffusion 203\u003c\/p\u003e \u003cp\u003e9.3.3 Heat Conduction 203\u003c\/p\u003e \u003cp\u003e9.3.4 Conjugate Forces When Temperature Is a Variable 205\u003c\/p\u003e \u003cp\u003e9.4 Cross-Effects in Irreversible Processes 206\u003c\/p\u003e \u003cp\u003e9.5 Cross-Effect Between Atomic Diffusion and Electrical Conduction 207\u003c\/p\u003e \u003cp\u003e9.5.1 Electromigration and Stress-Migration in Al Strips 209\u003c\/p\u003e \u003cp\u003e9.6 Irreversible Processes in Thermomigration 211\u003c\/p\u003e \u003cp\u003e9.6.1 Thermomigration in Unpowered Composite Solder Joints 212\u003c\/p\u003e \u003cp\u003e9.7 Cross-Effect Between Heat Conduction and Electrical Conduction 215\u003c\/p\u003e \u003cp\u003e9.7.1 Seebeck Effect 216\u003c\/p\u003e \u003cp\u003e9.7.2 Peltier Effect 218\u003c\/p\u003e \u003cp\u003eProblems 219\u003c\/p\u003e \u003cp\u003eReferences 219\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Electromigration 221\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 221\u003c\/p\u003e \u003cp\u003e10.2 To Compare the Parameters in Atomic Diffusion and Electric Conduction 222\u003c\/p\u003e \u003cp\u003e10.3 Basic of Electromigration 224\u003c\/p\u003e \u003cp\u003e10.3.1 Electron Wind Force 225\u003c\/p\u003e \u003cp\u003e10.3.2 Calculation of the Effective Charge Number 227\u003c\/p\u003e \u003cp\u003e10.3.3 Atomic Flux Divergence Induced Electromigration Damage 228\u003c\/p\u003e \u003cp\u003e10.3.4 Back Stress in Electromigration 230\u003c\/p\u003e \u003cp\u003e10.4 Current Crowding and Electromigration in 3-Dimensional Circuits 231\u003c\/p\u003e \u003cp\u003e10.4.1 Void Formation in the Low Current Density Region 234\u003c\/p\u003e \u003cp\u003e10.4.2 Current Density Gradient Force in Electromigration 238\u003c\/p\u003e \u003cp\u003e10.4.3 Current Crowding Induced Pancake-Type Void Formation in Flip-Chip Solder Joints 242\u003c\/p\u003e \u003cp\u003e10.5 Joule Heating and Heat Dissipation 243\u003c\/p\u003e \u003cp\u003e10.5.1 Joule Heating and Electromigration 244\u003c\/p\u003e \u003cp\u003e10.5.2 Joule Heating on Mean-Time-to-Failure in Electromigration 245\u003c\/p\u003e \u003cp\u003eProblems 245\u003c\/p\u003e \u003cp\u003eReferences 246\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Thermomigration 249\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 249\u003c\/p\u003e \u003cp\u003e11.2 Driving Force of Thermomigration 249\u003c\/p\u003e \u003cp\u003e11.3 Analysis of Heat of Transport, Q* 250\u003c\/p\u003e \u003cp\u003e11.4 Thermomigration Due to Heat Transfer Between Neighboring Pairs of Poweredand Unpowered Solder Joints 253\u003c\/p\u003e \u003cp\u003eProblems 255\u003c\/p\u003e \u003cp\u003eReferences 255\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Stress-Migration 257\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 257\u003c\/p\u003e \u003cp\u003e12.2 Chemical Potential in a Stressed Solid 258\u003c\/p\u003e \u003cp\u003e12.3 Stoney’s Equation of Biaxial Stress in Thin Films 260\u003c\/p\u003e \u003cp\u003e12.4 Diffusional Creep 264\u003c\/p\u003e \u003cp\u003e12.5 Spontaneous Sn Whisker Growth at Room Temperature 267\u003c\/p\u003e \u003cp\u003e12.5.1 Morphology 267\u003c\/p\u003e \u003cp\u003e12.5.2 Measurement of the Driving Force to Grow a Sn Whisker 271\u003c\/p\u003e \u003cp\u003e12.5.3 Kinetics of Sn Whisker Growth 272\u003c\/p\u003e \u003cp\u003e12.5.4 Electromigration-Induced Sn Whisker Growth in Solder Joints 275\u003c\/p\u003e \u003cp\u003e12.6 Comparison of Driving Forces Among Electromigration, Thermomigration, and Stress-Migration 277\u003c\/p\u003e \u003cp\u003e12.6.1 Products of Force 278\u003c\/p\u003e \u003cp\u003eProblems 279\u003c\/p\u003e \u003cp\u003eReferences 280\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Failure Analysis 281\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 Introduction 281\u003c\/p\u003e \u003cp\u003e13.2 Microstructure Change with or Without Lattice Shift 285\u003c\/p\u003e \u003cp\u003e13.3 Statistical Analysis of Failure 287\u003c\/p\u003e \u003cp\u003e13.3.1 Black’s Equation of MTTF for Electromigration 287\u003c\/p\u003e \u003cp\u003e13.3.2 Weibull Distribution Function and JMA Theory of Phase Transformations 289\u003c\/p\u003e \u003cp\u003e13.4 A Unified Model of MTTF for Electromigration, Thermomigration, and Stress-Migration 290\u003c\/p\u003e \u003cp\u003e13.4.1 Revisit Black’s Equation of MTTF for Electromigration 290\u003c\/p\u003e \u003cp\u003e13.4.2 MTTF for Thermomigration 292\u003c\/p\u003e \u003cp\u003e13.4.3 MTTF for Stress-Migration 292\u003c\/p\u003e \u003cp\u003e13.4.4 The Link Among MTTF for Electromigration, Thermomigration, and Stress-Migration 293\u003c\/p\u003e \u003cp\u003e13.4.5 MTTF Equations for Other Irreversible Processes in Open Systems 293\u003c\/p\u003e \u003cp\u003e13.5 Failure Analysis in Mobile Technology 293\u003c\/p\u003e \u003cp\u003e13.5.1 Joule Heating Enhanced Electromigration Failure of Weak-Link in 2.5D IC Technology 294\u003c\/p\u003e \u003cp\u003e13.5.2 Joule Heating Induced Thermomigration Failure Due to Thermal Crosstalk in 2.5D IC Technology 298\u003c\/p\u003e \u003cp\u003eProblems 301\u003c\/p\u003e \u003cp\u003eReferences 302\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 Artificial Intelligence in Electronic Packaging Reliability 303\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e14.1 Introduction 303\u003c\/p\u003e \u003cp\u003e14.2 To Change Time-Dependent Event to Time-Independent Event 304\u003c\/p\u003e \u003cp\u003e14.3 To Deduce MTTF from Mean Microstructure Change to Failure 305\u003c\/p\u003e \u003cp\u003e14.4 Summary 306\u003c\/p\u003e \u003cp\u003eIndex 307\u003c\/p\u003e \u003cp\u003e\u003cb\u003eKing-Ning Tu, PhD,\u003c\/b\u003e is TSMC Chair Professor at the National Chiao Tung University in Taiwan. He received his doctorate in Applied Physics from Harvard University in 1968.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eChih Chen, PhD,\u003c\/b\u003e is Chairman and Distinguished Professor in the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Materials Science from the University of California at Los Angeles in 1999. \u003c\/p\u003e\u003cp\u003e\u003cb\u003eHung-Ming Chen, PhD,\u003c\/b\u003e is Professor in the Institute of Electronics at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Computer Sciences from the University of Texas at Austin in 2003.  \u003c\/p\u003e\u003cp\u003e\u003cb\u003eDiscover a comprehensive exploration of the materials science and technology of electronic packaging\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eIn \u003ci\u003eElectronic Packaging Science and Technology,\u003c\/i\u003e an expert team of researchers delivers an insightful presentation of the modern state of electronic packaging and the role it plays in moving technology forward. The authors provide an overview of electronic packaging and provide the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. \u003c\/p\u003e\u003cp\u003eThe book also offers descriptions of the concepts and theory of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. Finally, the authors provide descriptions of the current state of the science of electronic packaging and its reliability. \u003c\/p\u003e\u003cp\u003eThe authors include real-world case studies at the end of each chapter to reinforce and illustrate the concepts contained within. The book also includes: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eA thorough introduction to the state-of-the-art of electronic packaging, including the impact of big data and discussions of packaging techniques\u003c\/li\u003e \u003cli\u003eA comprehensive exploration of electrical circuits in electronics packaging, including the principles of electronic circuit design, the design of redistribution layers, and the design of low power devices and circuits\u003c\/li\u003e \u003cli\u003eA practical discussion of the science of electronic packaging, including Joule heating, reliability issues in packaging technology, and solid-state reactions intrinsic diffusivity\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003ePerfect for scientists and engineers in research and industry labs, \u003ci\u003eElectronic Packaging Science and Technology\u003c\/i\u003e will also earn a place in the libraries of advanced undergraduate and graduate students studying materials science, physics, and electrical engineering.\u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47989117419749,"sku":"NP9781119418313","price":188.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1842\/7735\/files\/9781119418313.jpg?v=1761782866","url":"https:\/\/k12savings.com\/es\/products\/electronic-packaging-science-and-technology-isbn-9781119418313","provider":"K12savings","version":"1.0","type":"link"}