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Through Silicon Vias For 3d Integration

Through Silicon Vias For 3d Integration

por McGraw Hill
Agotado
$179.00 - $179.00
$179.00
$179.00 - $179.00
$179.00
Description
AUTHORS:

John Lau

PUBLISHER:

McGraw Hill

ISBN-10:

0071785140

ISBN-13:

9780071785143

BINDING:

Cloth

BISAC:

TECHNOLOGY & ENGINEERING: Telecommunications

PUBLICATION YEAR:

2012

LANGUAGE:

English

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